LTCC/HTCC/MLCC

This equipment is mainly used for processes such as pattern printing, micro-hole filling, and via wall metallization in the manufacturing of LTCC/HTCC multilayer substrates. It features automatic CCD image alignment, automatic printing, hole filling, and via plating functions. The machine allows adjustment of squeegee angle, pressure, snap-off distance, and speed to ensure high-efficiency and high-precision operation.

Worktable Size: 300mm × 300mm
Screen Frame Size: Compatible with □380mm to □550mm frames
Product Size: 8 inches
Product Fixing Method: Vacuum adsorption
Worktable Adjustment Range:

• X, Y: ±5mm

• θ: ±1.5°

Alignment Method: Visual alignment (dual CCD cameras)
Visual Alignment Accuracy: ±5μm
Repeat Positioning Accuracy: ±2μm
Screen Printing Height Adjustment Range: 0–10mm
Max Squeegee / Flood Bar Pressure: 300N
Max Squeegee / Flood Bar Speed: 300mm/s

Details