LTCC
MLCC
Advanced LTCC Via Filling Machine | China Suppliers & Factory for High-Precision Ceramic Substrates
Advanced LTCC Via Hole Filling Machine | High-Precision Interlayer Connectivity
Professional automated solution for precision via filling in LTCC and HTCC green tapes, featuring ±5 µm vision alignment and advanced electromagnetic pressure control for high-density multilayer ceramic substrates.
Ultra-High Alignment Accuracy
Utilizes proprietary vision alignment algorithms to achieve ±5 µm precision, ensuring perfect registration for micro vias below 100 µm diameter across multilayer stacks.
Steel Belt Drive Stability
Employs a high-rigidity steel belt drive system instead of traditional timing belts, providing smooth linear motion and zero-vibration speed control for superior filling uniformity.
Dynamic Pressure Regulation
Equipped with electromagnetic proportional valves delivering ±1 N pressure accuracy, enabling consistent paste flow even when using high-viscosity silver or tungsten pastes.
Core Technical Highlights
High-Precision Via Filling for Next-Generation Ceramic Substrates
The Advanced LTCC Via Hole Filling Machine is a cornerstone for the fabrication of high-density interconnect (HDI) multilayer ceramic circuits. As microelectronic components move toward miniaturization, the demand for precise interlayer connectivity becomes paramount. Our machine utilizes a high-resolution CCD vision system to align via holes with an industry-leading precision of ±5 µm. This ensures that conductive silver or gold pastes are deposited exactly where needed, maintaining electrical integrity in complex 5G modules and automotive sensor substrates.
Superior Motion Control and Filling Uniformity
Consistency is the key to high-yield production. By replacing traditional timing belts with a specialized steel belt drive system, our via filling machine eliminates the micro-vibrations and speed fluctuations that often cause "under-filling" or "voids" in micro vias. Combined with electromagnetic proportional valves that regulate printing pressure with ±1 N accuracy, the system provides a perfectly uniform paste fill. This advanced motion control is essential for processing high-viscosity pastes and deep via structures in both LTCC and HTCC manufacturing.
Versatile Performance for LTCC, HTCC, and Thick Film
Flexibility is engineered into every aspect of this system. It is fully compatible with standard 6-inch and 8-inch green tapes, and can be customized to handle various thick-film circuits or specialized film substrates. With a maximum filling pressure of 1500 N and multiple supported screen frame sizes, manufacturers can easily adapt the equipment for different product batches. The proprietary HMI software allows for rapid parameter adjustments, making it an ideal solution for both high-mix/low-volume R&D and high-volume mass production.
Automated Workflow for Cleanroom Efficiency
To meet the stringent requirements of smart factories, our LTCC via filler includes a fully integrated automatic paper take-up system. This feature maintains a clean working environment and allows for continuous operation without manual intervention for paper winding. The worktable features exceptional flatness (20 µm) and high-precision adjustment ranges in X, Y, and Theta axes, ensuring that every green sheet is processed under optimal conditions to maximize final product yield.
Technical Specifications
| No. | Item | Specification |
|---|---|---|
| 1 | Compatible Green Tape | 6-inch, 8-inch standard (Customizable) |
| 2 | Screen Frame Compatibility | 550x550, 450x450, 356x356, 320x320 mm formats |
| 3 | Filling Pressure Range | 0 - 1200 N (Optional up to 1500 N for deep vias) |
| 4 | Repeat Alignment Accuracy | ±10 µm |
| 5 | Filling Speed | 0 - 100 mm/s (Variable) |
| 6 | Worktable Repeatability | ±1 µm |
| 7 | Worktable Adjustment | X, Y ±5 mm | θ ±1.5° |
| 8 | Height Adjustment | Screen Height: 0 - 10 mm |
| 9 | Worktable Flatness | 20 µm overall table surface |
| 10 | Automation Features | Automatic Paper Take-up & proprietary HMI software |
Industrial Applications
RF & 5G Modules
Precision filling for high-frequency LTCC filters, antennas, and transceiver substrates.
Automotive Sensors
Reliable via-filling for HTCC ceramic pressure sensors and engine control units (ECUs).
Aerospace Packaging
Robust vertical interconnects for harsh-environment microelectronic ceramic packaging.
Frequently Asked Questions
What are the benefits of the ±5 µm vision alignment?
For modern LTCC designs, via diameters are often less than 100 µm. Even a slight misalignment can cause open circuits or high resistance. Our ±5 µm accuracy ensures that the paste is perfectly centered in the via, maximizing electrical conductivity.
Can this machine fill vias with high-viscosity silver paste?
Yes. The electromagnetic proportional valve provides extremely precise pressure control (up to 1500 N), which allows for stable extrusion and filling of thick conductive pastes without clogging or uneven distribution.
Why is a steel belt drive better than a timing belt?
Timing belts can stretch over time or introduce micro-jitter due to tooth engagement. A steel belt provides a smoother, more rigid linear motion, which directly improves the uniformity of the squeegee's movement and the consistency of the via-filling height.
Is the software compatible with Industry 4.0 standards?
Our proprietary control software is designed for smart factory integration, featuring an intuitive HMI for parameter tracking and batch management, supporting the traceability required in automotive and aerospace electronics.
What ranges of screen frame sizes are compatible with the machine?
The system supports multiple standard screen frame sizes including 550x550 mm, 450x450 mm, 356x356 mm, and 320x320 mm formats, allowing manufacturers to easily adapt the equipment for different production batches.
What is the worktable adjustment range and flatness specification?
The worktable features high-precision adjustment ranges in X and Y axes of ±5 mm, and a Theta (θ) axis adjustment of ±1.5°. Additionally, it provides exceptional overall table surface flatness of 20 µm to ensure optimal printing conditions.
Technical Support & Custom Via-Filling Solutions
Our expert engineering team provides advanced solutions for LTCC/HTCC and thick film production. Contact us for technical consultation and equipment configurations.
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