Advanced LTCC Via Hole Filling Machine

Core Technical Highlights

High-Precision Via Filling for Next-Generation Ceramic Substrates

The Advanced LTCC Via Hole Filling Machine is a cornerstone for the fabrication of high-density interconnect (HDI) multilayer ceramic circuits. As microelectronic components move toward miniaturization, the demand for precise interlayer connectivity becomes paramount. Our machine utilizes a high-resolution CCD vision system to align via holes with an industry-leading precision of ±5 µm. This ensures that conductive silver or gold pastes are deposited exactly where needed, maintaining electrical integrity in complex 5G modules and automotive sensor substrates.

Superior Motion Control and Filling Uniformity

Consistency is the key to high-yield production. By replacing traditional timing belts with a specialized steel belt drive system, our via filling machine eliminates the micro-vibrations and speed fluctuations that often cause "under-filling" or "voids" in micro vias. Combined with electromagnetic proportional valves that regulate printing pressure with ±1 N accuracy, the system provides a perfectly uniform paste fill. This advanced motion control is essential for processing high-viscosity pastes and deep via structures in both LTCC and HTCC manufacturing.

Versatile Performance for LTCC, HTCC, and Thick Film

Flexibility is engineered into every aspect of this system. It is fully compatible with standard 6-inch and 8-inch green tapes, and can be customized to handle various thick-film circuits or specialized film substrates. With a maximum filling pressure of 1500 N and multiple supported screen frame sizes, manufacturers can easily adapt the equipment for different product batches. The proprietary HMI software allows for rapid parameter adjustments, making it an ideal solution for both high-mix/low-volume R&D and high-volume mass production.

Automated Workflow for Cleanroom Efficiency

To meet the stringent requirements of smart factories, our LTCC via filler includes a fully integrated automatic paper take-up system. This feature maintains a clean working environment and allows for continuous operation without manual intervention for paper winding. The worktable features exceptional flatness (20 µm) and high-precision adjustment ranges in X, Y, and Theta axes, ensuring that every green sheet is processed under optimal conditions to maximize final product yield.

Technical Specifications

Industrial Applications

Frequently Asked Questions

What are the benefits of the ±5 µm vision alignment?

For modern LTCC designs, via diameters are often less than 100 µm. Even a slight misalignment can cause open circuits or high resistance. Our ±5 µm accuracy ensures that the paste is perfectly centered in the via, maximizing electrical conductivity.

Can this machine fill vias with high-viscosity silver paste?

Yes. The electromagnetic proportional valve provides extremely precise pressure control (up to 1500 N), which allows for stable extrusion and filling of thick conductive pastes without clogging or uneven distribution.

Why is a steel belt drive better than a timing belt?

Timing belts can stretch over time or introduce micro-jitter due to tooth engagement. A steel belt provides a smoother, more rigid linear motion, which directly improves the uniformity of the squeegee's movement and the consistency of the via-filling height.

Is the software compatible with Industry 4.0 standards?

Our proprietary control software is designed for smart factory integration, featuring an intuitive HMI for parameter tracking and batch management, supporting the traceability required in automotive and aerospace electronics.