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High-Precision Tape Casting Machine

Casting Thickness
3 - 300 μm
Thickness Accuracy
0.3 - 1 μm

The Ceramic Tape Casting Machine delivers 3–300 μm adjustable film thickness with ±1 μm precision, high-speed casting up to 6 m/min, and modular drying lengths up to 40 m. Designed for LTCC, HTCC, and SOFC substrate production, it integrates PLC-controlled slurry feeding, laser/ultrasonic flow monitoring, and CE-certified safety features. This advanced tape casting equipment ensures uniform coating, reliable drying, and scalable performance, making it ideal for high-end electronic ceramic manufacturing.


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    High-Precision Tape Casting Machine for LTCC & Electronic Ceramics

    Advanced tape casting solutions for LTCC, multilayer capacitors, sensors, and high-frequency electronic components with micron-level precision.

    Micron-Level Thickness Control

    3-300 μm casting range with ±0.3-1 μm accuracy for consistent dielectric properties.

    Flexible Production Scaling

    From R&D prototyping (0.1 m/min) to high-output production (6 m/min).

    Modular Design

    Customizable widths (220-1000+ mm) and drying lengths (6-40 m).

    Technical Specifications

    Thickness Range

    3–300 μm

    Adjustable for diverse material formulations

    Thickness Accuracy

    0.3–1 μm

    Precision gap control with real-time feedback

    Casting Speed

    0.1–6 m/min

    R&D to production with stability

    Standard Widths

    220 / 350 / 500 mm

    Custom widths available

    Drying Length

    6–40 m

    Adjustable for different processes

    Flow Accuracy

    ±0.1 mm

    Ultrasonic/laser-controlled dosing

    Ultra-Precise Thickness Control

    Accurate 0.3–1 μm ceramic tape thickness at a constant thickness from 3–300 μm, important for LTCC processing. Real-time feedback from advanced gap control guarantees homogeneous DC and high-frequency (HF) dielectrics.

    Flexible Production

    The variable casting speed 0.1–6 m/min allows the full product lifecycle extension applying from material testing to mass production. Keeps coating stability to give full surface quality required for multi-layer stack processing.

    Customizable Configuration

    The regular widths of 220, 350, 500 and 1000 mm are offered, custom widths available. Modular drying (6–40 m) enables different slurry mixt. and drying conditions.

    Intelligent Slurry Management

    A PLC-voltageregulator based supply system provides for continuous, steady slurry delivery with dosing precision of ±0.1 mm. Removes the need for manual interventions and guarantees equal tape thickness throughout the tape width.

    A Step Ahead in Drying

    Professional drying uniformity technology (Multi 10 K Hot air circulation system, Multi 10 Independent temperature control Ambient to 250ºC Accurate ±1ºC) provides multifold drying uniformity. Real time, in-line thickness measurement (option) allows process automation and optimization.

    Material Compatibility

    Intended for PET carrier films with a thickness between 50 and 188 μm. CE-certified, equipped with safety features such as over-temperature alarms, tension control and gas monitoring systems.

    LTCC & Electronic Ceramic Applications

    5G & RF Components

    Antennas, filters, and substrates requiring consistent dielectric properties.

    Multilayer Capacitors

    Uniform thin layers for SOFC with precise thickness control.

    Sensors & Microsystems

    Thin ceramic tapes for pressure, temperature, and gas sensors.

    Power Electronics

    Substrates and insulators for high-power modules.

    Medical Electronics

    Biocompatible ceramic layers for implantable devices.

    Automotive Electronics

    Robust ceramic components for harsh environments.

    Frequently Asked Questions

    What is the tape casting process?

    Tape casting produces thin, flat ceramic sheets by spreading slurry onto a moving carrier surface. The solvent evaporates in drying chambers, leaving flexible green tape that can be cut, stacked, and fired to create multilayer electronic components.

    What is the difference between slip casting and tape casting?

    Slip casting uses porous molds to create 3D shapes through capillary action. Tape casting spreads slurry on flat surfaces to create uniform thin sheets for flat, multilayer electronic components.

    What is casting tape?

    Casting tape (green tape) is the unfired, flexible ceramic sheet produced through tape casting. It contains ceramic particles, binders, and solvents, and can be processed into multilayer electronic components after drying.

    What are the different types of casting?

    Four primary methods: Tape Casting (thin ceramic sheets), Slip Casting (complex-shaped ceramics), Investment Casting (high-detail metal parts), and Die Casting (mass-produced metal components).

    Technical Support & Customization

    Our engineering team provides comprehensive support for LTCC process optimization. Custom configurations available for specific production requirements.

    Request Technical Consultation →

    No. Item Specification
    1 Casting Thickness 3-300μm
    2 Thickness Control Accuracy 0.3 - 1 μm
    3 Casting Speed 0.1- 6 m/min
    4 Casting Width 220mm, 350mm, 500mm, Customizable
    5 Drying Length 6m - 40m
    6 Carrier Thickness PET film 50 - 188 μm
    7 Automatic Feeding System Fully automatic feeding, PLC-controlled flow
    8 Slurry Dosage Flows Ultrasonic or laser control, with accuracy ±0.1 mm
    9 Safety CE Certified

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