LTCC
MLCC
MLCC High Precision Cutting Machine
MLCC High Precision Cutting Machine
Professional automated cutting solution for MLCC, LTCC, and HTCC substrates, engineered for high-volume production with micron-level positioning and advanced vision alignment.
High-Efficiency Throughput
Rapid processing with cutting cycles under 15 seconds per bar, maximizing output for large-scale ceramic component manufacturing.
Micron-Level Engineering
Achieves ±5μm positioning accuracy and ±0.02mm edge alignment, ensuring consistent quality and perfect electrode exposure.
Smart Automation
Features intelligent material sweeping, blade vibration for residue reduction, and bar stacking detection for seamless 24/7 operation.
Core Technical Highlights
Positioning Accuracy
±5 μm
Precise Y and Z axis motion control
Cutting Cycle
< 15 sec/bar
High-speed laminated bar processing
Rotation Precision
±0.0014°
Ultra-stable R-axis alignment
Alignment Accuracy
±0.02 mm
Consistent product edge alignment
Vision System
Dual CCD
Edge & Mark recognition modes
Division Modes
Up to 1-to-16
Flexible partitioning configurations
High-Precision Cutting for Advanced Electronic Ceramics
The MLCC High Precision Cutting Machine is specifically designed to meet the rigorous standards of modern electronic ceramic manufacturing. By integrating a high-performance motion platform with Y and Z axis positioning accuracy of ±5μm, the system ensures that every cut is executed with micron-level precision. This is critical for LTCC and HTCC applications where exact dimensional control directly impacts the electrical performance of the final multilayer components.
Advanced Dual-Camera Vision Alignment
To achieve an edge alignment accuracy of ±0.02mm, the machine utilizes a sophisticated dual-camera vision system. This system supports multiple recognition modes, including contour-based edge alignment and fiducial mark recognition. Whether using manual input or automatic calculation for trimming dimensions, the vision-assisted controls provide the flexibility needed for complex electrode patterns and diverse substrate formats like 225×225mm and 150×150mm.
Intelligent Material Handling and Waste Management
Operational efficiency is enhanced through a suite of smart automation features. The machine is equipped with an automatic material sweeping and pushing system that separates scrap from finished bars effortlessly. Furthermore, a unique blade holder vibration function is integrated to significantly reduce edge residue, ensuring clean, smooth cuts. The bar stacking detection system prevents errors during continuous production runs, maintaining a steady flow in fully automated MLCC production lines.
Modular Design for Scalable Industrial Production
Built on a modular architecture, this cutting machine is optimized for post-lamination processing. It offers multiple division modes—1-to-4, 1-to-9, and 1-to-16—allowing manufacturers to scale their processes according to specific MLCC or sensor designs. The robust system design ensures long-term reliability and minimal maintenance, making it a cornerstone for factories focused on next-generation electronic ceramics and 5G RF components.
Comprehensive Quality Assurance and Support
Engineered under strict quality management systems, our equipment complies with international safety standards. We provide full technical support, from initial requirement analysis to delivery and implementation. To ensure the best fit for your automation project, our engineering team utilizes technical drawings and process videos to provide a tailored proposal that meets your specific performance metrics and production timelines.
Technical Specifications
| No. | Item | Specification |
|---|---|---|
| 1 | Cutting Size | 225 × 225 mm and 150 × 150 mm |
| 2 | Cutting Speed | < 15 seconds per laminated bar |
| 3 | Positioning Accuracy | Y/Z Axis: ±5 μm; R Axis: 90° ±0.0014° |
| 4 | Edge Alignment | ±0.02 mm accuracy |
| 5 | Vision System | Dual-camera system (Edge & Mark alignment) |
| 6 | Trimming Modes | Manual and Automatic calculation options |
| 7 | Division Modes | Preset 1-to-4, 1-to-9, and 1-to-16 |
| 8 | Smart Features | Auto sweeping; Blade vibration; Bar stacking detection |
Industrial Applications
MLCC Production
High-precision dicing of multilayer capacitors with uniform electrode exposure.
LTCC/HTCC Substrates
Perfect for low and high-temperature co-fired ceramics used in RF and 5G modules.
Piezoelectric Devices
Clean and accurate cutting for sensitive ceramic sensors and actuators.
Frequently Asked Questions
How does the blade vibration function improve cutting quality?
The high-frequency vibration of the blade holder significantly reduces the friction and adhesion between the blade and the ceramic material. This results in cleaner edges with substantially less residue, which is essential for post-cut processing.
What is the difference between Edge and Mark alignment?
Edge alignment uses the physical contour of the bar for positioning, while Mark alignment identifies specific fiducial markers printed on the substrate. The machine supports both, allowing for maximum precision regardless of substrate design.
Can the machine handle multiple bar sizes simultaneously?
The system is compatible with various formats like 225×225mm and 150×150mm. While typically set for one batch size, the modular programs allow for quick changeovers between different substrate specifications.
What information is required to start a custom project?
To provide an accurate proposal, we recommend providing multi-angle product photographs, detailed technical drawings (specifications), and videos of your current manual or semi-auto process.
Request a Technical Consultation
Our engineering team is ready to analyze your MLCC production requirements and provide a comprehensive automation proposal.
Contact Our Engineers →| No. | Item | Specification |
|---|---|---|
| 1 | Cutting Size | 225 × 225 mm and 150 × 150 mm |
| 2 | Cutting Speed | ＜ 15 sec per laminted bar |
| 3 | Cutting Platform Positioning Accuracy |
Y-axis: ±5 μm Z-axis: ±5 μm R-axis: 90° ±0.0014° |
| 4 | Product Edge Alignment Accuracy | ±0.02 mm |
| 5 | Vision Alignment System | Dual-camera vision alignment system supporting both edge alignment and mark alignment modes |
| 6 | Edge Trimming Modes |
wo options — manual and automatic calculation of trimming dimensions |
| 7 | Three Cutting Division Modes | 1-to-4, 1-to-9, and 1-to-16 |
| 8 | Material Handling |
Equipped with automatic material sweeping and pushing functions Equipped with blade holder vibration function to significantly reduce edge residue issues. Equipped with bar stacking detection function |
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